MagI³C-VDMM Variable Step Down MicroModule

  • Picture
Size L
(mm)
W
(mm)
H
(mm)
LGA-6EP 3.2 2.5 1.6

Characteristics

  • Low conducted and radiated EMI (compliant to EN55022 class B / CISPR-22

LGA-6EP

  • Very low profile Micro-package
  • Ideal for space constrained applications
  • Small CIN and COUT integrated
  • 3 solder cycles supported

Applications

  • Point-of-Load DC/DC applications from 5 V or 3.3 V rail
  • Replacement for linear regulators
  • Interface and microcontroller supply
  • DSP and FPGA power supply auxiliary voltages
  • Portable instruments
  • Battery powered equipment

Products

  SPEC Order Code Simu-
lation
Ui UO IO
(A)
Evaluation Board Samples
MagI³C-VDMM Variable Step Down MicroModule PDF 171960501 RE 2.7 - 5.5 V 0.6 - 5.5 V 0.6 178960501