Odyssey MAX 10 FPGA and BLE Sensor Kit

Topologie: Boost
Eingangsspannung (min.): 3.30 V
Eingangsspannung (max.): 3.30 V

Erstveröffentlichung am 10.02.2015, Version 2.2 vom


The Mpression Odyssey MAX 10 FPGA and BLE Sensor Kit is an evaluation board ideal for doing Internet of Things (IoT) proof-of-concept development. The board is designed to allow users to evaluate the use of and write software for the BCM20737S BLE module, Max10 FPGA, EnergyMicro Giant Gecko microcontroller, and the sensors included in the kit for use in their own end products.This kit encompass everything users need to connect wirelessly using Bluetooth® Low Energy (BLE), collect information from the environment and even add custom designs using programmable logic. The Odyssey MAX 10 FPGA and BLE Sensor Kit contains a BLE sensor board, an FPGA expansionboard and a battery board. The BLE sensor board has a Bluetooth SMART device, a microcontroller and various sensors. The sensors include UV and ambient light, pulse rate and blood oximetry, temperature and humidity as well as acceleration. It also features a physical interface to either the battery board or the FPGA expansion board. The FPGA expansion board includes an FPGA for programmable logic, a microphone, LEDs, switches, push-buttons and expansion capabilities to an Arduino Nano. The battery board allows the user to power the BLE sensor board off a coin cell battery for true wireless applications. An I2C expansion port and a J-Link interface to program the microcontroller are also integrated on the battery boardThe kit is designed to interact with a Smartphone via the BLE link. This communications link is used to exercise the sensors and other interfaces by means of a complex firmware infrastructure. Depending on individual needs, users can easily use the existing framework to implement a designor users can modify the firmware to achieve unique design goals.It is the object of this document to both introduce the first time user to the details of connecting to and using the Odyssey kit as well as expose some details of the underling framework for more experienced engineers that need to build upon the existing infrastructure.


  Artikel Nr. SPEC Simu-
Produktfamilie Z @ 100 MHz
Z @ 1 GHz
RDC max.
Typ Montageart IR 1
IR 2
Emitting Color λPeak typ.
λDom typ.
IV typ.
VF typ.
Chiptechnologie 50% typ.
Verpackungseinheit Pins Reihen Gender IR 1
Verpackung Muster
7427927218 PDF RE WE-CBF SMT-Ferrit 180 227 0.3 260 Wide Band SMT 400 900
150060VS75000 PDF RE WL-SMCW SMD Mono-color Chip LED Waterclear Bright Green 572 570 40 2 AlInGaP 140
416131160804 PDF WS-DISV Small Compact SMD Flat Actuator with Top Tape 1.27 mm 6.25 2000
61301021121 PDF WR-PHD 2.54 mm THT Dual Pin Header Board Stacker 10 Dual Pin Header 3 Beutel