WE-SECF SMD EMI Contact Finger

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Article Specific Files

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  • Characteristics
  • Applications
  • Design Kits
  • suitable for automated placement
  • Material: copper-beryllium (CuBe) gold-plated (Au)
  • Different types and sizes available
  • Corrossion-resistant
  • Wear-resistant
  • High temperatures and mechanical weight have no influence on the excellent connection properties
  • Reliable solderability
  • Customized materials and platings are possible
  • Customized types and sizes are possible
  • Contact between PCB's earth and housing
  • Low Ω HF connection between earthing points of two PCB's lying upon each other
  • Earthing of cooling units on high frequency
  • Connection between signal and power supply of two PCB's on track
  • Connection between PCB's and extern elements

Articles from this family can be found in the following Design Kits:

SPEC Order Code L
(mm)
W
(mm)
H
(mm)
Material Included in Files Samples
PDF 331011452048 4.6 2 4.8 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331011452048-rev1.igsSTEP-331011452048-rev1.stp
PDF 331011452535 4.5 2.5 3.5 Copper Beryllium (CuBe) gold-plated(AU)
PDF 331031271520 2.7 1.5 2 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331031271520-rev1.igsSTEP-331031271520-rev1.stp
PDF 331031321515 3.2 1.5 1.5 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331031321515-rev1.igsSTEP-331031321515-rev1.stp
PDF 331041402053 4.1 2 5.3 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331041402053-rev1.igsSTEP-331041402053-rev1.stp
PDF 331051472057 4.7 2 5.7 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331051472057-rev1.igsSTEP-331051472057-rev1.stp
PDF 331061603010 6 3 10 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331061603010-rev1.igsSTEP-331061603010-rev1.stp
PDF 331081302025 3 2 2.5 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331081302025-rev1.igsSTEP-331081302025-rev1.stp
PDF 331141352540 3.5 2.5 4 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331141352540-rev1.igsSTEP-331141352540-rev1.stp
PDF 331151702562 7.15 2.5 6.2 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331151702562-rev1.igsSTEP-331151702562-rev1.stp
PDF 331161452070 4.5 2 7 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331161452070-rev1.igsSTEP-331161452070-rev1.stp
PDF 331161702513 7 2.5 13 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331161702513-rev1.igsSTEP-331161702513-rev1.stp
PDF 331171302030 3.15 2 3 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331171302030-rev1.igsSTEP-331171302030-rev1.stp
PDF 331171302035 3 2 3.5 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331171302035-rev1.igsSTEP-331171302035-rev1.stp
PDF 331211503040 5 3 4 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331211503040-rev1.igsSTEP-331211503040-rev1.stp
PDF 331221602040 6 2 4 Copper Beryllium (CuBe) gold-plated(AU) Design Kit SMD EMI Kontaktfinger WE-SECF
IGS-331221602040-rev1.igsSTEP-331221602040-rev1.stp
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Tags: WE-SECF, AbsSECF, EMC Shielding Material, WE-SECF SMD EMI Contact Finger, Spring Contact, Coil Spring